HANDBOOK OF SEMICONDUCTOR WAFER CLEANING TECHNOLOGY Science, Technology, and ApplicationsEdited byWerner Kern Werner Kern Associates East Windsor, New JerseyNOYES PUBLICATIONS WeStwOOd,New Jersey, U.S.A.Copyright 8 1993 by Noyes Publications No part of this book may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying, recording or by any information storage and retrieval system, without permission in writing from the Publisher. Library of Congress Catalog Card Number: 93-4078 ISBN: O-8155-1331-3 Printed in the United States Published in the United States of America by Noyes Publications Fairview Avenue, Westwood, New Jersey 65Library of Congress Cataloging-in-PublicationDataHandbook of semiconductor wafer cleaning technology: science,technology, and applications /edited by Werner Kern. Includes bibliographical references and index.ISBN O-8155-1331-3 1. Semiconductor wafers-Cleaning. TK7871.85.H335 621.3815%-dc2019931. Kern, Werner.
93-4078 CIP1925-MATERIALSSCIENCEAND PROCESSTECHNOLOGYSERIESEditors Rointan F. Bunshah, University of California, Los Angeles (Series Editor) Gary E. McGuire, Microelectronics Center of North Carolina (Series Editor) Stephen M. Rossnagel, IBM Thomas J. Watson Research Center (Consulting Editor)ElectronicMaterialsand Process TechnologyHANDBOOK OF DEPOSITION TECHNOLOGIES Edition: edited by Rointan F. Bunshah CHEMICALVAPORSEMICONDUCTOR Gary E. McGuireDEPOSITION MATERIALSFOR MICROELECTRONICS: AND PROCESSHYBRID MICROCIRCUITTECHNOLOGY EnlowBEAM DEPOSITIONHANDBOOK OF CONTAMINATION Donald L.
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HoSecondby Arthur ShermanTECHNOLOGYHANDBOOK:HANDBOOK OF THIN FILM DEPOSITION Klaus K. Schuegraf IONIZED-CLUSTERFOR FILMS AND COATINGS,by Toshinoriedited byTakagiMICROELECTRONICMATERIALS:IN MICROELECTRONICS:editedbyHANDBOOK OF ION BEAM PROCESSING TECHNOLOGY: Stephen M. Rossnagel, and Harold R. Android emulator download apk. Kaufmanedited by Jerome J. Cuomo,CHARACTERIZATION McGuireVolume 1: edited by Gary E.OF SEMICONDUCTORMATERIALS,HANDBOOKOFPLASMA PROCESSING TECHNOLOGY: Jerome J.
Cuomo, and William D. Westwood HANDBOOK OF SEMICONDUCTOR SILICON O’Mara, Robert B. Herring, and Lee P. Hunt HANDBOOK OF POLYMER Licari and Laura A. HughesCOATINGSTECHNOLOGY:FOR ELECTRONICS,HANDBOOK HayakawaOF SPUTTER DEPOSITIONHANDBOOK N.
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Rossnagel,TECHNOLOGY:by WilliamMATERIALS:C.Second Edition: by Jamesby Kiyotaka Wasa and Shigeruedited by William B. GlendinningOF TUNGSTENELECTROCHEMISTRY OF SEMICONDUCTORS McHardy and Frank Ludwigeditedand Johnedited by Terre11 A. VanderahAND TUNGSTENSILICIDES:AND ELECTRONICS:by Johnedited by JohnviSeriesHANDBOOK DIAMONDOF CHEMICALVAPORDEPOSITION:FILMS AND COATINGS:ELECTRODEPOSITION: HANDBOOK Werner Kern CONTACTSby Hugh 0. Piersonedited by Robert F. Davisby Jack W.
DiniOF SEMICONDUCTORWAFERTO SEMICONDUCTORS:CLEANINGTECHNOLOGY:OF CARBON,GRAPHITE,DIAMONDSADVANCED BinnerCERAMICCOMPOSITES:PROCESSINGSHOCK WAVES FOR INDUSTRIAL SPECIALOF MATERIALS:APPLICATIONS:MELTING AND PROCESSINGCORROSION OF GLASS, CERAMICS David E. Clark and Bruce K. Zoitos HANDBOOK OF INDUSTRIAL and Gordon L. Barna CERAMICFILMS AND COATINGS:ELECTRONICSANDAND CERAMICVolume 1: edited by Jon G. P.by Peter J. Blauedited by LawrenceTECHNOLOGIES:REFRACTORIESby Hugh 0.edited by K.
MazdiyasniAND TECHNOLOGY,AND WEAR TRANSITIONSFRICTIONedited byand TechnologySOL-GELTECHNOLOGY FOR THIN FILMS, FIBERS, PREFORMS, SPECIALTY SHAPES: edited by Lisa C. Klein CERAMICCIRCUITS:AND FULLERENES:Ceramic and Other Materials-ProcessingFIBER REINFORCEDbyedited by Leonard J. BrillsonHANDBOOK OF MULTlLEVEL METALLIZATION FOR INTEGRATED Syd R. Wilson, Clarence J. Tracy, and John L. HANDBOOK PiersoneditedE.
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Wachtmanand Richard A. HaberRelated Titles ADHESIVESTECHNOLOGYHANDBOOKOF THERMOSETSURFACE WegmanPREPARATIONFORMULATlNGHANDBOOK: PLASTICS:TECHNIQUESby Arthur H. Landrock edited by Sidney H. Goodman FOR ADHESIVEPLASTICS AND ELASTOMERSHANDBOOK OF ADHESIVE and Thomas R. Tulles CARBON-CARBON D. Edie CODE COMPLIANCEBY COMPUTER:BONDED STRUCTURALMATERIALSAND COMPOSITES:FOR ADVANCEDBONDING:TECHNOLOGYREPAIR:by RaymondF.by Ralph D. Hermansen by RaymondF.
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Chaska, MNBruce E. Deal Department ofDepartment of Electrical EngineeringElectrical Engineering Stanford University Stanford, CAStanford University Stanford, CAInc.Fremont, CAC. Robert HelmsGregg S.
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RudderSemiTest, Inc. Billerica, MAResearch Triangle InstituteWerner KernJerzy Ruzyllo Department of ElectricalWerner Kern AssociatesResearch Triangle Park, NCand Computer EngineeringEast Windsor, NJVenu B. Menon SEMATECH, Austin, TXThe Pennsylvania State University University Park, PAInc.Raymond E. ThomasRobert J. NemanichResearch Triangle Institute Research Triangle Park, NCDepartment of Physics North Carolina State University Raleigh, NCMotorola/SEMATECH,Charlie A. PetersonUniversity of Arizona Tucson, AZEmpak Chanhassen,John R.
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